Electronic Ceramic Components / Ceramic Electronic Parts
1. Description:
Chip-type capacitors are the main products of electronic ceramic components due to their superior frequency performance and volume efficiency, which meets the requirement from the advanced electronic devices. A schematic view of multilayer ceramic capacitor (MLCC) is shown in Figure 1. The capacitor is composed of many thin plate capacitors in parallel connection. The capacitance of MLCC with electrode area S, dielectric layer thickness t, and the number of dielectric layers n is given by it.
2. Feature Advantages:
1) High hardness and high density
2) Low thermal conductivity
3) Chemical inertness
4) Good wear resistance
5) High Fracture toughness
6) Good insulation performance
7) High temperature resistance
8) A variety of specifications is available
9) Satisfy various technical requests
10) Lower medium spoilage
11) Stiffness texture
12) Chemical inertness
13) Good wear resistance
14) High Fracture toughness
15) Good insulation performance
3. Material Features / Properties:
| Composite | (wt %) | 99% | 99.5% | 99.8% |
| Color | | White or Ivory | White or Ivory | White or Ivory |
| Density | g/cm 3 | 3.82 | 3.9 | 3.92 |
| Hardness | HRA | 83 | 85 | 85 |
| Flexural Strength | Mpa (psi*10 3 ) | 375 | 386 | 381 |
4. Technical Parameters:
| Technical Parameters of Ceramics |
| Items | Test Conditions | Unit or Symbol | 99% AL2O3 | 95% AL2O3 | 90% AL2O3 | Zirconia | Steatite | Silicon Carbide |
| Volume Density | -- | g/cm3 | ≥3.70 | ≥3.62 | ≥3.40 | ≥5.90 | ≥2.60 | ≥3.08 |
| Tightness | -- | Pa·m³/s | ≤1.0×10-11 | ≤1.0×10-11 | ≤1.0×10-11 | - | - | - |
| Liquid Permeability | -- | -- | Pass | Pass | Pass | | Pass | - |
| Flexural Strength | - | MPa | ≥300 | ≥280 | ≥230 | ≥1100 | ≥120 | ≥400 |
| Elastic Modulus | - | GPa | - | ≥280 | ≥250 | ≥220 | - | 400 |
| Poisson Ratio | - | - | - | 0.20～0.25 | 0.20～0.25 | - | - | - |
| Thermal Shock Resistance | 800℃( Room Temperature) Cycle: 10 times | | Pass | Pass | Pass | - | - | - |
| Coefficient of Linear Expansion | 20℃～100℃ | ×10-6 K-1 | - | - | - | | ≤8 | - |
| 20℃～500℃ | ×10-6 K-1 | 6.5～7.5 | 6.5～7.5 | 6.5～7.5 | 6.5～11.2 | - | - |
| 20℃～800℃ | ×10-6 K-1 | 6.5～8.0 | 6.5～8.0 | 6.3～7.3 | | - | 4 |
| 20℃～1200℃ | ×10-6 K-1 | - | 7.0～8.5 | - | - | - | - |
| Coefficient of Thermal Conductivity | 20℃ | W/(m·k) | - | - | - | - | - | 90～110 |
| 1000℃ |
| Dielectric Constant | 1MHz 20℃ | - | 9.0～10.5 | 9.0～10 | 9.0～10 | - | ≤7.5 | - |
| 1MHz 50℃ | - | - | 9.0～10 | - | - | - | - |
| 10GHz 20℃ | - | 9.0～10.5 | 9.0～10 | 9.0～10 | - | - | - |
| Volume Resistivity | 100℃ | Ω·cm | ≥1.0×1013 | ≥1.0×1013 | ≥1.0×1013 | - | ≥1.0×1012 | - |
| 300℃ | ≥1.0×1013 | ≥1.0×1010 | ≥1.0×1013 | - | - | - |
| 500℃ | ≥1.0×109 | ≥1.0×108 | -- | - | - | - |
| Disruptive Strength | D.C | kV/mm | ≥17 | ≥15 | ≥15 | - | ≥20 | - |
| Chemical Durability | 1:9HCl | mg/c㎡ | ≤0.7 | ≤7.0 | - | - | - | - |
| 10%NaOH | mg/c㎡ | ≤0.1 | ≤0.2 | - | -- | - | - |
| Grain Size | - | μm | - | 3~12 | - | - | - | - |
5. Process Flows:
Formulating --- Granulating --- Forming --- Sintering --- Grinding --- Printing --- Nickel Plating --- Assembing --- Brazing --- Inspecting --- Packing
6. Application Fields:
Widely apply for new energy vehicles, charging piles, solar power generation, energy storage and power storage system, electric vehicle power system and so on.
7. Production Facilities: Prilling Tower , Forming Machine , High Temperature Sintering Kiln
8. Detection Devices:
Electric Performance Tester , Film Thickness Analyzer , Granulometer , Helium Mass Spectrometer Leak Detector , Universal Pull Force Meter
9.Order Flow Steps as belows: Inquiry ---Quotation --- Place an order --- Production --- Delivery
10. Our advantages: Quality Assurance ; Price Competitive ; Factory Supply Directly ; Good Service
11.Shipping and Package:
12. Our aimed market :
Notes:Above information only for reference and please contact with us for more details freely when you have any inquiry!
Product Tags:
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ISO9001 High Temperature Ceramics Insulation In Electornics Images
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